Aluminum nitride (AlN) ceramics exhibit excellent physical properties, including high thermal conductivity, low dielectric constant, high strength, high hardness, non-toxicity, and a thermal expansion coefficient similar to that of silicon. Additionally, they demonstrate outstanding chemical stability and corrosion resistance. AlN-based multilayer co-fired substrates, used as dielectric isolation materials, are ideal for heat dissipation and packaging in high-power modules and large-scale integrated circuits.
I. Manufacturing Process of AlN Co-fired Substrates
The production process of AlN high-temperature co-fired ceramic (HTCC) multilayer substrates involves mixing AlN powder with sintering aids and additives to form a ceramic slurry. This slurry is then shaped into green ceramic sheets via tape casting. Pre-designed circuits are fabricated on these green sheets through processes such as drilling, filling, and printing using metal pastes. The sheets are then laminated and subjected to high-temperature sintering to produce highly thermally conductive and dense ceramic substrates.
Since high-thermal-conductivity AlN ceramics typically require sintering temperatures above 1600°C, conventional precious metal conductors like Pd-Ag or Au are unsuitable for co-firing with AlN. Instead, high-melting-point metals such as tungsten (W, melting point 3400°C) and molybdenum (Mo, melting point 2623°C) are used as co-fired conductors. However, W and Mo pastes exhibit poor solderability, necessitating surface plating with nickel, palladium, and gold to enhance solderability for subsequent assembly.
High-temperature co-firing is a critical step in manufacturing AlN multilayer ceramic substrates, significantly impacting their flatness, conductor adhesion, and sheet resistance.
II. Application Fields of AlN Co-fired Substrates
AlN multilayer ceramic substrates combine the advantages of traditional multilayer ceramic substrates in 3D integration with superior thermal dissipation capabilities. They enable rapid heat dissipation while increasing packaging density and matching the thermal expansion coefficients of semiconductor materials. These substrates have broad application prospects in high-density, high-power multichip modules (MCMs), LED packaging, optical communication packaging, and MEMS packaging.
Multichip Modules (MCMs)
The advancement of large-scale integrated circuits imposes higher demands on inter-chip interconnections. High-density packaging technologies have become mainstream in high-end electronic systems. MCMs represent an advanced form of microelectronic packaging, integrating bare chips and micro-components onto a high-density wiring substrate to form functional modules or even subsystems. MCMs also facilitate miniaturization and high-density integration of electronic systems, serving as a critical pathway for system integration. High-density multilayer substrate technology is key to achieving high-density packaging in MCMs.
MEMS
MEMS systems integrate sensors, actuators, and control/drive circuits, combining microelectronics and micromechanical technologies. In MEMS, these components are tightly interconnected and mutually influential. The circuitry generates significant heat, while the mechanical components are fragile and prone to damage. Ensuring reliable signal transmission and effective protection between components is crucial, placing higher demands on MEMS packaging technologies.
About Xiamen Juci Technology
Juci Technology leverages high-purity raw materials, advanced composite additives, and precision sintering processes to enable stable mass production of high-performance AlN ceramic substrates. With flexible customization and rigorous quality control, we meet the demanding requirements of high-power LEDs, IGBT modules, 5G RF devices, and aerospace applications—making us a leading domestic supplier of ultra-high thermal conductivity aluminum nitride solutions.
Media Contact:
Xiamen Juci Technology Co., Ltd.
Phone: +86 592 7080230
Email: miki_huang@chinajuci.com
Website: www.jucialnglobal.com
