Why is bismaleimide resin can be used in Industrial Glue?
1. Thermal Stability: BMI resins manufactured by Yangchen Tech possess high thermal stability, meaning they can withstand elevated temperatures without degrading. This property is crucial for industrial applications where adhesives may be exposed to high temperatures during operation or curing processes.
2. Mechanical Strength: BMI resins provide excellent mechanical strength, which translates to strong and durable bonds. This is essential for industrial glue applications that require high structural integrity and the ability to resist mechanical stresses and strains.
3. Chemical Resistance: BMI resins are resistant to various chemicals, including solvents, acids, and bases. This makes them ideal for use in harsh chemical environments where the adhesive might come into contact with aggressive substances.
4. Electrical Properties: BMI resins have favorable electrical properties, such as a low dielectric constant and high insulation resistance. These properties are important for electronic and electrical applications where maintaining electrical integrity is critical.
5. Long-Term Durability: The long-term durability of BMI resins ensures that the adhesive maintains its performance characteristics over extended periods, even under adverse conditions. This reliability is essential for industrial applications that demand long-lasting bonds.
Typical Formula for Industrial Glue Using Bismaleimide Resin
The formulation of industrial glue using BMI resin powder manufactured by Yangchen Tech can vary based on the specific application and performance requirements. However, a typical formulation might include the following components:
1. Bismaleimide Resin Powder:
The primary component providing the adhesive properties, thermal stability, and mechanical strength.
2. Reactive Diluents:
Used to adjust the viscosity of the adhesive for easier application. These are often low molecular weight compounds that can copolymerize with the BMI resin.
3. Curing Agents:
Chemicals that initiate or accelerate the curing process, converting the liquid or semi-liquid adhesive into a solid bond. Common curing agents for BMI resins include diamines, diacids, and anhydrides.
4. Fillers and Reinforcements:
Added to enhance specific properties of the adhesive, such as mechanical strength, thermal conductivity, or electrical insulation. Examples include silica, carbon fibers, and mica.
5. Additives:
Various additives can be included to improve processing, stability, and performance. These might include stabilizers, adhesion promoters, and toughening agents.
Certification of Analysis by Yangchen Tech
|
ITEM |
Limits |
Results |
|
Appearance |
Yellow powder |
Yellow powder |
|
Solubility |
Dissolved, with trace impurities |
Fully soluble, clear |
|
Melting Point℃ |
150-160 |
155-158 |
|
Ash% |
≤0.3 |
0.06 |
|
Water% |
≤0.5 |
0.12 |
|
Acidity mgkoH/g |
≤5 |
1.0 |
|
Gel time |
≤300 |
160 |
Recipe for reference：
Bismaleimide Resin Powder: 50-70%
Reactive Diluent (e.g., N-vinyl-2-pyrrolidone): 10-20%
Curing Agent (e.g., 4,4'-diaminodiphenyl sulfone): 5-15%
Filler (e.g., silica powder): 5-10%
Additives (e.g., adhesion promoter, stabilizer): 1-5%
Bismaleimide resin powder is used in industrial glue formulations due to its exceptional thermal stability, mechanical strength, chemical resistance, and long-term durability. By combining BMI resins with suitable reactive diluents, curing agents, fillers, and additives, formulators can create high-performance adhesives tailored to meet the demanding requirements of various industrial applications.Welcome Inquire!