Semiconductor devices require the use of semiconductor equipment such as etching machines, photolithography machines, and ion implantation machines. Inside these semiconductor devices, numerous ceramic components are used. Ceramic materials offer excellent properties, including high-temperature resistance, corrosion resistance, high precision, and high strength, making them well-suited for use in semiconductor equipment. Many ceramic components are key parts in semiconductor processes, directly contacting the wafers. They can achieve precise control of wafer surface temperature and rapid heating or cooling.
Semiconductor ceramic components belong to advanced ceramics, typically made from high-purity, ultra-fine inorganic materials, such as alumina (Al₂O₃), silicon carbide (SiC), aluminum nitride (AlN), silicon nitride (Si₃N₄), and yttria (Y₂O₃). The types of semiconductor ceramic components include semiconductor robotic arms, ceramic nozzles, ceramic windows, ceramic cavity covers, porous ceramic vacuum suction cups, and others.
The preparation process for semiconductor ceramic components mainly includes powder preparation, powder molding, high-temperature sintering, precision machining, quality inspection, and surface treatment.
Regarding sintering processes, some ceramic components undergo de-binding followed by sintering, while in others, de-binding and sintering are performed simultaneously. Typically, the de-binding temperature is lower than the sintering temperature and does not exceed 1000°C. High-temperature sintering methods mainly include pressureless sintering, vacuum sintering, and atmosphere sintering. Sintering transforms the ceramic from a green body to a dense structure.
The main sintering processes are as follows:
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Pressureless Sintering
Pressureless sintering refers to the process where the material is sintered under atmospheric pressure without the application of additional pressure. This is the most commonly used sintering method, typically performed in an oxygen atmosphere or a special gas atmosphere. During pressureless sintering, the formed green body is not subjected to external pressure, and the powder particles aggregate and form crystalline bonds under normal atmospheric pressure. -
Vacuum Sintering
Vacuum sintering is the process of sintering ceramic green bodies under a vacuum environment. Through physical and chemical actions, the green body is transformed into a dense and hard sintered body. In oxide ceramic bodies, the pores are primarily filled with water, hydrogen, and oxygen, which escape during sintering. However, gases such as carbon monoxide, carbon dioxide, and especially nitrogen are difficult to escape through the pores, leading to reduced density in the final product. Vacuum sintering ensures that all gases are expelled, improving the product's density. -
Atmosphere Sintering
For ceramics that are difficult to sinter under pressureless sintering, atmosphere sintering is commonly used. In this method, specific gases are introduced into the furnace to create the required atmosphere for sintering the ceramic components. Depending on the material, different atmospheres such as oxygen, hydrogen, nitrogen, or argon may be used. -
